Three-dimensional heat conducting structure and manufacturing method thereof
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United States of America Patent
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Sep 18, 2018
Grant Date -
Dec 1, 2016
app pub date -
Jul 8, 2015
filing date -
May 25, 2015
priority date (Note) -
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Abstract
In a three-dimensional heat conducting structure and its manufacturing method, the manufacturing method includes the steps of (a) providing a vapor chamber having at least one insert hole; (b) providing a heat pipe having an open end, and inserting the open end into the insert hole; (c) providing a support ring, and sheathing the support ring on a joint position of the heat pipe and the vapor chamber; and (d) providing a soldering means, and applying the soldering means between the support ring and the heat pipe.
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