Method for depositing a copper seed layer onto a barrier layer and copper plating bath
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United States of America Patent
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Sep 18, 2018
Grant Date -
Jul 7, 2016
app pub date -
Sep 11, 2014
filing date -
Sep 25, 2013
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Abstract
The present invention relates to a method for providing a copper seed layer on top of a barrier layer wherein said seed layer is deposited onto said barrier layer from an aqueous electroless copper plating bath comprising a water-soluble source for Cu(II) ions, a reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof. The resulting copper seed layer has a homogeneous thickness distribution and a smooth outer surface which are both desired properties.
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