Hot melt adhesive

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United States of America Patent

PATENT NO 10077383
APP PUB NO 20160272853A1
SERIAL NO

15166386

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The object of the present invention is to provide a hot melt adhesive which is less likely to cause stringing and has excellent thermal stability, and further has excellent adhesion, in particular adhesion to a paper substrate. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) a butyral resin, (C) an olefin-based polymer, and (D) a tackifier resin.

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAA40589 DÜSSELDORF

International Classification(s)

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  • 2016 Application Filing Year
  • C09J Class
  • 1319 Applications Filed
  • 856 Patents Issued To-Date
  • 64.90 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takamori, Ai Osaka, JP 23 33

Cited Art Landscape

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Patent Citation Ranking

  • 3 Citation Count
  • C09J Class
  • 34.56 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges478071101 - 1011 - 2021 - 3031 - 400510152025303540455055606570758085

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