Polishing pad and method for making the same

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United States of America Patent

PATENT NO 10076818
APP PUB NO 20160089764A1
SERIAL NO

14799445

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Abstract

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The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a plurality of first trenches. The first trench has an opening at the first surface. The polishing layer is located on the first surface of the base layer and fills the first trenches. The polishing layer has a plurality of second trenches, the positions of the second trenches correspond to those of the first trenches, and the depth of the second trenches is less than that of the first trenches.

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Patent Owner(s)

Patent OwnerAddress
SAN FANG CHEMICAL INDUSTRY CO LTDKAOHSIUNG CITY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feng, Chung-Chih Kaohsiung, TW 112 308
Hung, Yung-Chang Kaohsiung, TW 45 119
Wang, Lyang-Gung Kaohsiung, TW 21 42
Yao, I-Peng Kaohsiung, TW 79 189

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