Metallic copper dispersion, process for producing the metallic copper dispersion, electrode, wiring pattern, and coating film formed using the metallic copper dispersion, decorative article and antimicrobial article with the coating film formed thereon, and processes for producing the decorative article and the antimicrobial article

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United States of America Patent

PATENT NO 10071419
APP PUB NO 20110155432A1
SERIAL NO

13060898

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Abstract

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A dispersion comprising at least metallic copper particles with gelatin provided on the surface thereof, a polymeric dispersant, and an organic solvent. The dispersion is produced by reducing copper oxide in an aqueous solvent in the presence of gelatin having an amine number and an acid number wherein the difference (amine number−acid number) is 0 or less, then subjecting the reaction solution to solid-liquid separation, and then mixing the resultant metallic copper particles with gelatin provided on the surface thereof and a polymeric dispersant having an amine number and an acid number wherein the difference (amine number−acid number) is 0 to 50, into an organic solvent. The dispersion maintains dispersion stability of the metallic copper particles for a long time, is suitable for inkjet printing and spray coating and can be used to make microelectrodes and circuit wiring patterns.

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Patent Owner(s)

Patent OwnerAddress
ISHIHARA SANGYO KAISHA LTDNISHI-KU OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ida, Kiyonobu Yokkaichi, JP 4 36
Tomonari, Masanori Yokkaichi, JP 10 72

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