Heat module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 4, 2018
Grant Date -
Feb 4, 2016
app pub date -
May 12, 2015
filing date -
Jul 29, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A heat module includes a fan, a heat sink, a heat transfer member, and a plurality of connection portions. The heat transfer member includes a lower surface capable of being in thermal contact with a heat source, and an upper surface thermally connected to the heat sink, and is arranged to overlap with at least a portion of the fan in a plan view. The plurality of connection portions are arranged between the heat transfer member and the housing to define an axial gap between an upper surface of the heat transfer member and a lower surface of the lower plate portion. The heat transfer member includes a heat source contact portion arranged on a side, closer to the fan, of an end portion of the fan at which the air outlet is defined.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully