Circuit board for a microphone component part, and microphone module having such a circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 14, 2018
Grant Date -
Oct 6, 2016
app pub date -
Sep 11, 2014
filing date -
Nov 15, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Measures are described by which the back volume of a microphone component can be realized regardless of its packaging. Within the framework of a microphone module, a circuit board is used for the 2nd-level mounting of at least one microphone component part, in whose surface at least one connection opening is formed, which terminates in a cavity in the layer structure of the circuit board. In addition, the circuit board surface having the connection opening is configured for a sealing mounting of the microphone component part above the connection opening, so that the microphone component is acoustically connected to the cavity in the circuit board via the connection opening in the circuit board surface, and this cavity functions as backside volume for the microphone component part.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully