Method of fabricating a semiconductor module with a inclined groove formed in resin side surface
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United States of America Patent
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Aug 14, 2018
Grant Date -
Feb 8, 2018
app pub date -
Jul 26, 2017
filing date -
Aug 5, 2016
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Abstract
A manufacturing method of a semiconductor module includes: sealing an assembly with resin, the assembly including a semiconductor chip, a heat-dissipation plate on the semiconductor chip, and multiple terminals, such that the resin includes a first surface, a second surface located opposite to the first surface, and a side surface, a groove extends in the side surface from the first surface to the second surface, an inner surface of the groove includes a first tapered surface, and a second tapered surface provided between the first tapered surface and the first surface, the second tapered surface inclining toward the first surface at a greater inclination angle than an inclination angle of the first tapered surface; and cutting the first surface within an area located on a first surface side from a boundary between the first tapered surface and the second tapered surface such that the heat-dissipation plate exposes.
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