Method and system for tool condition monitoring based on a simulated inline measurement
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 14, 2018
Grant Date -
Jun 13, 2013
app pub date -
Dec 8, 2011
filing date -
Dec 8, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method and system for removing control action effects from inline measurement data for tool condition monitoring is disclosed. An exemplary method includes determining a control action effect that contributes to an inline measurement, wherein the inline measurement indicates a wafer characteristic of a wafer processed by a process tool; and evaluating the inline measurement without the control action effect contribution to determine a condition of the process tool.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully