Circuit interconnect system and method
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United States of America Patent
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app pub date -
Jun 12, 2014
filing date -
Jun 12, 2014
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Abstract
A circuit interconnect generally comprises an electrical connection pad, a shape memory material, and a flowable conductor. The electrical connection pad has an upper surface, a portion of which is covered by the shape memory material. The flowable conductor extends through the shape memory material and is electrically coupled to the electrical connection pad. The shape memory material has a first configuration at a first temperature and a second configuration at a second temperature. In the instance of the second temperature being greater than the first, the shape memory material has a first configuration that is substantially planar and a second configuration that is cupped.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B41J:TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. M....
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- H01R:ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL AS....
- C22F:CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS MET....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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