Form-in-place conductive and waterproof colloid
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United States of America Patent
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Jan 12, 2017
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Nov 28, 2016
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Abstract
The present invention discloses a form-in-place conductive and waterproof colloid, being composed of: dimethyl siloxane or dimethylvinyl-terminated or vinyl terminated polydimethylsiloxane; hydroxy terminated polydimethylsiloxane; dispersant; dimethyl, methylhydrogen siloxane crosslinking agent; adhesion promoter; Pt catalyst; forming agent; hydrocarbon solvent; Nickel Graphite; thickening agent; Trimethylated silica; and inhibitor. With the implementation of the present invention, no production mold or die cutter is required to simplify the process of applying the colloid and reduce the cost of applying, and with the characteristics of being providing waterproof and dustproof capability for enclosures, providing excellent adhesion capability, providing excellent compressibility and resilience, isolating EMI and providing EMI shielding capability at the same time. Besides, the space required is small when forming or applying making the colloid suitable for applications to small or mini devices and save the cost of material and cost of implementation.
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