Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board

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United States of America Patent

PATENT NO 10034371
SERIAL NO

15112251

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Abstract

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A resin composition for a printed wiring board including:

    a cyanate compound represented by the following general formula (1); andan epoxy resin,

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI GAS CHEMICAL COMPANY INC5-2 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 1008324 ?1008324

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arii, Kenji Okayama, JP 6 24
Hiramatsu, Sotaro Tokyo, JP 7 22
Kobayashi, Takashi Tokyo, JP 692 7856
Mabuchi, Yoshinori Tokyo, JP 15 79
Sogame, Masanobu Tokyo, JP 19 99

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