Semiconductor device with trench-like feed-throughs
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United States of America Patent
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Apr 5, 2016
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Oct 30, 2009
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Abstract
A semiconductor device (e.g., a flip chip) includes a substrate layer that is separated from a drain contact by an intervening layer. Trench-like feed-through elements that pass through the intervening layer are used to electrically connect the drain contact and the substrate layer when the device is operated.
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