Polymer via plugs with high thermal integrity
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United States of America Patent
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Mar 27, 2012
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Mar 27, 2012
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Abstract
The present disclosure relates to providing via plugs in vias of a semiconductor material. The via plugs may be formed of a polymer, such as a polyimide, that can withstand subsequent soldering and operating temperatures. The via plugs effectively fill the vias to prevent the vias from being filled substantially with solder during a subsequent soldering processes.
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