Resin composition, and prepreg and laminated sheet using the same

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United States of America Patent

PATENT NO 10017660
SERIAL NO

13701034

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Abstract

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There is provided a resin composition that exhibits excellent heat resistance, heat conductivity, and water absorption. The resin composition comprises a cyanate ester resin (A) represented by formula (I), an epoxy resin (B), and an inorganic filler (C), the content of the inorganic filler (C) being 301 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B)

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI GAS CHEMICAL COMPANY INC5-2 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 1008324 ?1008324

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ohtsuka, Hajime Kamisu, JP 3 27
Sogame, Masanobu Matsudo, JP 19 99
Ueyama, Daisuke Kashiwa, JP 22 49

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