Composition for hot-melt extrusion and method for producing hot-melt extrusion product using same

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United States of America Patent

PATENT NO 10016508
SERIAL NO

14294258

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Abstract

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Provided are a composition for hot-melt extrusion which can be hot-melt extruded at a temperature lower than a conventional temperature and therefore free of heat-induced deactivation of a drug; and a method for producing a hot-melt extrusion product which is simpler than a spray-drying method. More specifically, provided is a composition for hot-melt extrusion including a drug and hypromellose acetate succinate (HPMCAS) having a hydroxypropoxy molar substitution of 0.40 or more. Also provided is a method for producing a hot-melt extrusion product including a step of hot-melt extruding a composition for hot-melt extrusion including a drug and hypromellose acetate succinate having a hydroxypropoxy molar substitution of 0.40 or more at a hot-melt temperature of melting temperature of the hypromellose acetate succinate or higher, or at a hot-melt temperature equal to or higher than a temperature at which both the hypromellose acetate succinate and the drug become melted.

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Patent Owner(s)

Patent OwnerAddress
SHIN-ETSU CHEMICAL CO LTDTOKYO 100-0004

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kikuchi, Kazuki Niigata-ken, JP 15 30
Kusaki, Fumie Tokyo, JP 14 32
Maruyama, Naosuke Niigata-ken, JP 52 186
Obara, Sakae Tokyo, JP 21 55
Warashina, Shogo Niigata-ken, JP 6 11

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