Importance

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Abstract

Compositions and methods are described for a temporary adhesive with adjustable adhesion force to affix a thin solid material onto a carrier whereby the force of adhesion is defined by choosing and adjusting the polymeric resin components to provide sufficient adhesion to support a manufacturing process, and upon completion, the thin solid material is removed by an external applied force of a given value that overcomes the adhesive force without harm to the thin solid material. The temporary adhesive provides a tunable adhesion force that is lower than the tensile strength of the thin solid material, preferably less than 50%, more preferably less than 25%, and most preferably less than 10% of the tensile strength of the thin solid material. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the thin solid material and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult thin solid materials in the manufacture of semiconductors and flat panel displays.

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First Claim