DER AVOORT CASPER VAN

Inventor

Add to Portfolio

Stats

Details

Work History

Patent OwnerApplications FiledYear
KNOWLES ELECTRONICS ASIA PTE. LTD.
2
2010
NXP B.V.
2
4
2
4
2
4
2
2008
2010
2011
2012
2013
2014
2015
AMS INTERNATIONAL AG
11
2014

Inventor Addresses

AddressDuration
Eindhoven, NLFeb 25, 16 - Oct 03, 17
GB WAALRE, NLJul 25, 19 - Jul 25, 19
GB Waalre, NLDec 28, 21 - Dec 28, 21
Prinsenhof, DEJan 28, 16 - Jan 31, 17
TG WAALRE, NLAug 01, 19 - Aug 01, 19
TG Waalre, NLNov 05, 20 - Jun 21, 22
WAALRE, NLNov 11, 10 - Nov 11, 10
Waalre, NLJun 02, 11 - Dec 31, 24

Technology Profile

Technology Matters
B81B: MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 8
B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 6
F16M: FRAMES, CASINGS, OR BEDS, OF ENGINES OR OTHER MACHINES OR APPARATUS, NOT SPECIFIC TO AN ENGINE, MACHINE, OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS OR SUPPORTS 1

See more…

Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
121800662024Sensor package and method of producing the sensor package0
2023/0126,5982023Attachment of Stress Sensitive Integrated Circuit Dies0
115487812023Attachment of stress sensitive integrated circuit dies0
114545622022Sensor arrangement and method of operating a sensor arrangement0
114274652022Capacitive sensors having temperature stable output0

See more…


We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
> Upgrade to our Level for up to -1 portfolios!.