SU ZHENG
Inventor
Stats
- 0 US patents issued
- 1 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 1 US Applications Filed
- 0 Total Citation Count
- Oct 18, 2022 Most Recent Filing
- Oct 18, 2022 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Hefei, CN | Apr 20, 23 - Mar 04, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B22F: | WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER | 1 |
| C01G: | COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F | 1 |
| C22C: | ALLOYS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12241142 | 2025 | Preparation method for W-Cu composite plate with Cu phase in finger-shaped gradient distribution | 0 |
| 2023/0117,192 | 2023 | PREPARATION METHOD FOR W-CU COMPOSITE PLATE WITH CU PHASE IN FINGER-SHAPED GRADIENT DISTRIBUTION | 0 |
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