Thomas Zetterer

Inventor

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Work History

Patent OwnerApplications FiledYear
TPO HONG KONG HOLDING LIMITED
1
2004
KONINKLIJKE PHILIPS ELECTRONICS N.V.
1
2004
VINOTAL GMBH (NOW KNOWN AS RUDOLPH TECHNOLOGIES GERMANY GMBH)
1
1994
SCHOTT AG
4
1
1
2009
2014
2016
INTERNATIONAL BUSINESS MACHINES CORPORATION
1
1994
INSTITUT FUR MIKROTECHNIK MAINZ GMBH
1
1
1994
1996
LEYBOLD VAKUUM GMBH
1
1997

Inventor Addresses

AddressDuration
Engelstadt, DEApr 14, 98 - Jun 16, 05
Landshut, DEMay 12, 11 - Jun 06, 24
Landshut, DE, USAug 09, 16 - Aug 09, 16
Mainz, DEJan 30, 25 - Jan 30, 25
Schwabenheim, DENov 14, 95 - Mar 26, 96

Technology Profile

Technology Matters
A61N: ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY 1
B01D: SEPARATION 1
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 4

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2025/0033,8532025HERMETIC LASER-WELDED ENCLOSURE0
2024/0186,0352024ELECTRICAL FEEDTHROUGH0
119935112024Hermetically sealed, toughened glass package and method for producing same0
119759622024Hermetically sealed transparent cavity and package for same0
2022/0406,6722022HERMETICALLY SEALED GLASS PACKAGE0

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