Hyein YOO
Inventor
Stats
- 2 US patents issued
- 9 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 9 US Applications Filed
- 53 Total Citation Count
- Apr 22, 2022 Most Recent Filing
- Jun 11, 2015 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY | 2
| 2015
|
| SAMSUNG ELECTRONICS CO., LTD. | 1
3 | 2016
2017 |
Inventor Addresses
| Address | Duration |
|---|---|
| PYEONGTAEK-SI, KR | Dec 21, 17 - Dec 21, 17 |
| Pyeongtaek-si, KR | Jun 22, 17 - Feb 16, 21 |
| Seoul, KR | Oct 13, 16 - Dec 12, 17 |
| Suwon-si, KR | Dec 14, 17 - Dec 31, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C09J: | ADHESIVES; ADHESIVE PROCESSES IN GENERAL | 2 |
| G01J: | MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 9 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12183653 | 2024 | Thermal conductive film | 1 |
| 2022/0246,491 | 2022 | THERMAL CONDUCTIVE FILM | 1 |
| 11355413 | 2022 | Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same | 1 |
| 10923465 | 2021 | Semiconductor device having stacked semiconductor chips and method for fabricating the same | 1 |
| 2020/0211,920 | 2020 | ADHESIVE FILM, SEMICONDUCTOR APPARATUS USING THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 3 |
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