Isao Yokokawa
Inventor
Stats
- 28 US patents issued
- 41 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 28 US Patents Issued
- 41 US Applications Filed
- 552 Total Citation Count
- Jul 27, 2021 Most Recent Filing
- Jun 29, 1999 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SHIN-ETSU HANDOTAI CO., LTD. | 3
7 7 7 10 6 3 4 6 3 4 | 1999
2001 2002 2004 2005 2008 2010 2011 2012 2013 2014 |
Inventor Addresses
| Address | Duration |
|---|---|
| Annaka, JP | Aug 01, 06 - Mar 24, 15 |
| Gunma, JP | Oct 31, 02 - Jun 14, 11 |
| Gunma-ken, JP | Jun 12, 01 - May 20, 03 |
| Takasaki, JP | Oct 30, 14 - Jan 05, 21 |
| Takasaki-shi, JP | May 24, 18 - Aug 24, 23 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B08B: | CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL | 1 |
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2023/0268,222 | 2023 | METHOD FOR MANUFACTURING SOI WAFER AND SOI WAFER | 0 |
| 2023/0154,761 | 2023 | METHOD FOR MANUFACTURING SOI WAFER | 0 |
| 10886163 | 2021 | Method for manufacturing bonded wafer | 0 |
| 10763157 | 2020 | Method for manufacturing SOI wafer | 0 |
| 2020/0203,217 | 2020 | METHOD FOR MANUFACTURING BONDED WAFER | 0 |
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