Jae Hak Yee

Inventor

Add to Portfolio

Stats

Details

Work History

Patent OwnerApplications FiledYear
AMKOR TECHNOLOGY, INC.
1
6
4
1
1
1
1
1999
2000
2001
2002
2003
2004
2006
St Assembly Test Services Pte Ltd
2
2
2002
2003
STATS CHIPPAC LTD.
1
2010
ST ASSEMBLY TEST
1
2000
STATS CHIPPAC PTE. LTE.
1
4
2
6
10
6
4
4
2
2
2000
2002
2003
2006
2007
2008
2009
2010
2011
2012
BANK OF AMERICA, N.A.
1
1
1
1
2002
2003
2004
2006

Inventor Addresses

AddressDuration
Mansion, SGApr 01, 04 - Apr 01, 04
S.K. Mansion, SGNov 11, 03 - Nov 11, 03
Sam-Kiang Mansion, SGFeb 03, 04 - Feb 03, 04
Seoul, KRSep 10, 02 - Jul 21, 09
Shanghai, CNJun 11, 09 - Feb 03, 15
Singapore, KRJan 02, 03 - Feb 22, 05
Singapore, SGFeb 21, 02 - Dec 01, 15

Technology Profile

Technology Matters
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 36

Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
92027762015Stackable multi-chip package system0
89468782015Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor2
89373722015Integrated circuit package system with molded strip protrusion0
88474132014Integrated circuit package system with leads having multiple sides exposed0
88100192014Integrated circuit package system with stacked die0

See more…


We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
> Upgrade to our Level for up to -1 portfolios!.