Chin-Tsai Yao
Inventor
Stats
- 11 US patents issued
- 21 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 11 US Patents Issued
- 21 US Applications Filed
- 93 Total Citation Count
- Nov 21, 2019 Most Recent Filing
- Apr 28, 2010 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SILICONWARE PRECISION INDUSTRIES CO., LTD. | 4
7 1 11 2 2 | 2010
2012 2013 2014 2015 2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| Taichung City, TW | Jul 20, 17 - Mar 19, 20 |
| Taichung Hsien, TW | Mar 06, 14 - Apr 21, 15 |
| Taichung, TW | Jul 21, 11 - Apr 30, 24 |
| Taichung, US | Aug 20, 15 - Aug 20, 15 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C25D: | PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 20 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 5 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11973014 | 2024 | Method of manufacturing substrate structure with filling material formed in concave portion | 0 |
| 10679932 | 2020 | Semiconductor package and a substrate for packaging | 0 |
| 2020/0091,059 | 2020 | METHOD OF MANUFACTURING SUBSTRATE STRUCTURE WITH FILLING MATERIAL FORMED IN CONCAVE PORTION | 4 |
| 10522453 | 2019 | Substrate structure with filling material formed in concave portion | 2 |
| 10510720 | 2019 | Electronic package and method for fabricating the same | 4 |
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