Junrong Yan
Inventor
Stats
- 2 US patents issued
- 24 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 24 US Applications Filed
- 64 Total Citation Count
- Jun 15, 2022 Most Recent Filing
- Nov 18, 2014 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD. | 1
1 | 2014
2017 |
| SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD. | 3
1 | 2014
2017 |
| SUNWAVE COMMUNICATIONS CO., LTD. | 3
| 2015
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hangzhou, CN | Jan 09, 18 - Sep 11, 18 |
| Hangzhou, Zhejiang Province, CN | Dec 14, 17 - Dec 14, 17 |
| Hangzhou, Zhejiang, CN | Apr 01, 21 - Apr 01, 21 |
| Minhang District, CN | Oct 22, 20 - Mar 29, 22 |
| Niskayuna, NY, US | Aug 01, 19 - Oct 10, 23 |
| SHANGHAI, CN | Dec 30, 21 - Dec 30, 21 |
| Seattle, WA, US | Jun 09, 20 - Feb 01, 22 |
| Shanghai, CN | Jun 04, 15 - Sep 10, 24 |
| Zhejiang, CN | Sep 13, 22 - Sep 13, 22 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 1 |
| B29K: | INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS | 1 |
| B29L: | INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12083715 | 2024 | Mold compound dispensing system and method | 0 |
| 11901327 | 2024 | Wire bonding for semiconductor devices | 0 |
| 11894343 | 2024 | Vertical semiconductor device with side grooves | 0 |
| 2023/0411,169 | 2023 | SEMICONDUCTOR WAFER THINNED BY HORIZONTAL STEALTH LASING | 0 |
| 2023/0402,323 | 2023 | Semiconductor Wafer Dicing Method | 0 |
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