Zhiliang XIA

Inventor

Add to Portfolio

Stats

Details

Work History

Patent OwnerApplications FiledYear
SAMSUNG ELECTRONICS CO., LTD.
2
9
2013
2016

Inventor Addresses

AddressDuration
HWASEONG-SI, KRAug 18, 16 - Aug 18, 16
Hubei, CNDec 17, 19 - Apr 01, 25
Hwaseong-Si, KRFeb 16, 17 - Feb 16, 17
Hwaseong-si, KRMay 15, 14 - Sep 17, 24
Wuhan City, CNJan 30, 20 - Jan 30, 20
Wuhan, CNJan 10, 19 - Apr 10, 25

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1
G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 1
G06F: ELECTRIC DIGITAL DATA PROCESSING 1

See more…

Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2025/0120,0862025THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME0
2025/0120,0902025EMBEDDED PAD STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATION METHODS THEREOF0
2025/0111,8802025NON-VOLATILE MEMORY DEVICES AND DATA ERASING METHODS0
122664032025Three-dimensional NAND memory and fabrication method thereof0
122625332025Dynamic flash memory (DFM) with multi-cells0

See more…


We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
> Upgrade to our Level for up to -1 portfolios!.