YEN-JU WU
Inventor
Stats
- 2 US patents issued
- 12 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 12 US Applications Filed
- 5 Total Citation Count
- Oct 4, 2023 Most Recent Filing
- Jan 21, 2016 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| NATIONAL CENTRAL UNIVERSITY | 1
| 2016
|
| ARCHIT LENS TECHNOLOGY INC. | 3
| 2016
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hsinchu, TW | Feb 01, 24 - Apr 10, 25 |
| Sheffield, GB | Apr 04, 17 - Oct 11, 18 |
| TAICHUNG CITY, TW | Jul 07, 16 - Jul 07, 16 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| G01J: | MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY | 3 |
| G01N: | INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES | 2 |
| G01V: | GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0118,598 | 2025 | INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF | 0 |
| 2024/0420,994 | 2024 | INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME | 0 |
| 2024/0413,075 | 2024 | INTERCONNECT STRUCTURE HAVING HEAT DISSIPATION CAPABILITY AND METHOD FOR MANUFACTURING THE SAME | 0 |
| 2024/0087,980 | 2024 | ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIPATION FEATURE | 0 |
| 2024/0038,665 | 2024 | INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME | 0 |
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