Tung-Shen Wu
Inventor
Stats
- 1 US patents issued
- 1 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 1 US Applications Filed
- 3 Total Citation Count
- Jun 5, 2002 Most Recent Filing
- Jun 5, 2002 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| Orient Semiconductor Electronics, Ltd. | 1
| 2002
|
Inventor Addresses
| Address | Duration |
|---|---|
| Kaohsiung, TW | Aug 19, 03 - Aug 19, 03 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 6608391 | 2003 | Preparation method of underfill for flip chip package and the device | 2 |
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