Muhong Wu
Inventor
Stats
- 0 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 2 US Applications Filed
- 1 Total Citation Count
- Sep 4, 2020 Most Recent Filing
- Jun 4, 2019 Earliest Filing
Work History
No Work History Available.Inventor Addresses
Address | Duration |
---|---|
Beijing, CN | May 05, 22 - Jan 21, 25 |
Technology Profile
Technology | Matters | |
---|---|---|
B21B: | ROLLING OF METAL | 1 |
B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
C22F: | CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
12203193 | 2025 | Preparation method for ultrahigh-conductivity multilayer single-crystal laminated copper material, and copper material | 0 |
12188150 | 2025 | Method for clonal-growth of single-crystal metal | 0 |
2023/0080,832 | 2023 | PREPARATION METHOD FOR ULTRAHIGH-CONDUCTIVITY MULTILAYER SINGLE-CRYSTAL LAMINATED COPPER MATERIAL, AND COPPER MATERIAL | 0 |
2022/0136,134 | 2022 | METHOD FOR CLONAL-GROWTH OF SINGLE-CRYSTAL METAL | 0 |
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