Hsiao Che Wu
Inventor
Stats
- 5 US patents issued
- 18 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 5 US Patents Issued
- 18 US Applications Filed
- 118 Total Citation Count
- Jun 13, 2023 Most Recent Filing
- Jan 18, 2000 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 1
| 2000
|
| SIEMENS AKTIENGESELLSCHAFT | 1
| 2000
|
| PROMOS TECHNOLOGIES INC. | 3
1 4 1 3 1 5 1 | 2000
2001 2004 2005 2006 2007 2008 2009 |
| MOSEL VITELIC, INC. | 2
| 2000
|
Inventor Addresses
| Address | Duration |
|---|---|
| Chung Li City, TW | Jun 01, 06 - Jun 01, 06 |
| Chung-Li, TW | Aug 07, 01 - Aug 28, 01 |
| Hsinchu, FR | Apr 18, 24 - Apr 18, 24 |
| Hsinchu, TW | Oct 24, 02 - Apr 25, 24 |
| Jhongli City, TW | Dec 13, 07 - Dec 13, 07 |
| Jhongli, TW | Apr 27, 06 - May 23, 06 |
| Jungli City, TW | Mar 21, 02 - Mar 21, 02 |
| TAOYUAN COUNTY, TW | Jan 21, 10 - Jan 21, 10 |
| Taoyuan County, TW | Dec 24, 09 - Apr 26, 11 |
| Taoyuan Hsien, TW | Feb 16, 06 - May 21, 09 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05C: | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
| B24B: | MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING | 2 |
| C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2024/0134,123 | 2024 | PHOTONIC INTEGRATED CIRCUIT STRUCTURE | 0 |
| 2024/0126,017 | 2024 | PHOTONIC INTEGRATED CIRCUIT STRUCTURE | 0 |
| 7932565 | 2011 | Integrated circuit structure having bottle-shaped isolation | 3 |
| 7781830 | 2010 | Recessed channel transistor and method for preparing the same | 3 |
| 2010/0038,745 | 2010 | INTEGRATED CIRCUIT STRUCTURE HAVING BOTTLE-SHAPED ISOLATION | 9 |
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