Mark C Woods
Inventor
Stats
- 3 US patents issued
- 10 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 3 US Patents Issued
- 10 US Applications Filed
- 389 Total Citation Count
- Jun 5, 2024 Most Recent Filing
- Oct 10, 2000 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| MARLOW INDUSTRIES, INC. | 1
2 1 | 2009
2010 2012 |
| 3M INNOVATIVE PROPERTIES COMPANY | 1
2 | 2000
2002 |
| QORVO US, INC. | 1
| 2017
|
Inventor Addresses
| Address | Duration |
|---|---|
| Allen, TX, US | Apr 04, 13 - Apr 04, 13 |
| Dallas, TX, US | Apr 01, 10 - Apr 01, 10 |
| P.O. Box 33427, St. Paul, MN 55133-3427 | Nov 25, 03 - Nov 25, 03 |
| Pflugerville, TX | Sep 07, 04 - Sep 07, 04 |
| Pflugerville, TX, US | Jun 17, 04 - Jun 17, 04 |
| Richardson, TX, US | Aug 12, 10 - Jan 16, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C12M: | APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY | 1 |
| F25B: | REFRIGERATION MACHINES, PLANTS, OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS | 3 |
| F25D: | REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHER SUBCLASS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0022,765 | 2025 | TOP SIDE COOLING FOR POWER AMPLIFIER MODULE | 0 |
| 2023/0343,721 | 2023 | MULTICHIP MODULE THERMAL MANAGEMENT THROUGH BACKSIDE METAL | 0 |
| 11551995 | 2023 | Substrate with embedded active thermoelectric cooler | 0 |
| 10840165 | 2020 | Electronics package with improved thermal performance | 0 |
| 2019/0252,287 | 2019 | ELECTRONICS PACKAGE WITH IMPROVED THERMAL PERFORMANCE | 0 |
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