Martin Weigert
Inventor
Stats
- 29 US patents issued
- 49 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 29 US Patents Issued
- 49 US Applications Filed
- 862 Total Citation Count
- Oct 25, 2014 Most Recent Filing
- Feb 4, 1991 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| MICROPELT GMBH | 1
| 2005
|
| LEYBOLD MATERIALS GMBH | 1
1 1 | 1993
1994 1995 |
| AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. | 2
2 2 5 4 | 2002
2006 2008 2013 2014 |
| Heraeus, Inc. | 1
1 | 1991
1994 |
| DEGUSSA AG | 1
| 1993
|
| HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG | 1
2 2 1 | 1994
2001 2002 2007 |
| INFINEON TECHNOLOGIES AG | 1
1 2 2 4 2 2 | 1997
1999 2001 2002 2003 2004 2005 |
| FINISAR CORPORATION | 1
1 5 2 | 1999
2000 2004 2005 |
| THE UNIVERSITY OF CHICAGO | 1
| 2007
|
| EZCONN CORPORATION | 2
2 1 | 2002
2004 2005 |
| AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD. | 1
| 2005
|
| BALZERS UND LEYBOLD DEUTSCHLAND HOLDING AKTIENGESELLSCHAFT | 1
| 1993
|
| W.C. HERAEUS GMBH | 1
2 1 2 2 1 | 2002
2003 2004 2005 2007 2008 |
| HERCULES INCORPORATED | 1
| 1994
|
| OSRAM OPTO SEMICONDUCTORS GMBH | 2
| 2003
|
Inventor Addresses
| Address | Duration |
|---|---|
| Berhanrdswald, DE | Mar 02, 06 - Jun 05, 07 |
| Berlin, DE | Jan 09, 03 - Jun 19, 07 |
| Bernhardswald, DE | Mar 24, 05 - Aug 26, 08 |
| Chicago, IL | Jan 03, 08 - Jan 03, 08 |
| Eherzhausen, DE | Sep 07, 06 - Sep 07, 06 |
| Etterzhausen, DE | Jul 30, 09 - Sep 22, 15 |
| Etterzhausen/Bavaria, DE | Sep 17, 15 - Jan 10, 17 |
| Etterzhausen/Nittendorf, DE | Dec 18, 14 - Jul 05, 16 |
| Hanau, DE | May 12, 92 - Nov 12, 09 |
| Hardt, DE | May 25, 99 - Oct 13, 09 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B22C: | FOUNDRY MOULDING | 1 |
| B22D: | CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES | 3 |
| B22F: | WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9541503 | 2017 | Compact systems, compact devices, and methods for sensing luminescent activity | 0 |
| 9443835 | 2016 | Methods for performing embedded wafer-level packaging (eWLP) and eWLP devices, packages and assemblies made by the methods | 2 |
| 9385667 | 2016 | Photodetector integrated circuit (IC) having a sensor integrated thereon for sensing electromagnetic interference (EMI) | 3 |
| 2016/0011,111 | 2016 | COMPACT SYSTEMS, COMPACT DEVICES, AND METHODS FOR SENSING LUMINESCENT ACTIVITY | 4 |
| 9142746 | 2015 | Light-emitting diodes on a wafer-level package | 3 |
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