Ryoko Watanabe
Inventor
Stats
- 2 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 5 US Applications Filed
- 60 Total Citation Count
- Jun 18, 2019 Most Recent Filing
- Nov 14, 2006 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TOKYO INSTITUTE OF TECHNOLOGY | 2
| 2006
|
| MITSUBISHI GAS CHEMICAL COMPANY, INC. | 2
| 2012
|
| ASAHI KASEI CHEMICALS CORPORATION | 1
| 2014
|
Inventor Addresses
| Address | Duration |
|---|---|
| Kanagawa, JP | Apr 22, 21 - Mar 14, 23 |
| Niigata, JP | Jul 21, 15 - Jul 21, 15 |
| Niigata-shi, JP | Dec 19, 13 - Dec 19, 13 |
| Tokyo, JP | Apr 28, 16 - Feb 19, 19 |
| Yokohama, JP | Apr 24, 12 - Apr 24, 12 |
| Yokohama-shi, JP | May 07, 09 - May 07, 09 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B01J: | CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS | 1 |
| B31D: | MAKING OTHER PAPER ARTICLES | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11603548 | 2023 | Fc-binding protein exhibiting improved alkaline resistance, method for producing said protein, antibody adsorbent using said protein, and method for separating antibody using said antibody adsorbent | 0 |
| 2021/0261,605 | 2021 | Fc-BINDING PROTEIN EXHIBITING IMPROVED ALKALINE RESISTANCE, METHOD FOR PRODUCING SAID PROTEIN, ANTIBODY ADSORBENT USING SAID PROTEIN, AND METHOD FOR SEPARATING ANTIBODY USING SAID ANTIBODY ADSORBENT | 1 |
| 2021/0116,445 | 2021 | METHOD FOR SEPARATING ANTIBODY, AND METHOD FOR TESTING ON DISEASE | 1 |
| 10208206 | 2019 | Curable resin composition and cured product thereof, sealing material for optical semiconductor, die bonding material, and optical semiconductor light-emitting element | 0 |
| 2016/0115,318 | 2016 | Curable Resin Composition and Cured Product Thereof, Sealing Material for Optical Semiconductor, Die Bonding Material, and Optical Semiconductor Light-Emitting Element | 3 |
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