Matthew B Wasserman

Inventor

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Work History

Patent OwnerApplications FiledYear
KULICKE AND SOFFA INDUSTRIES, INC.
6
8
7
2
2014
2015
2016
2017

Inventor Addresses

AddressDuration
Fort Washington, PA, USDec 01, 22 - Aug 13, 24
Philadelphia, PA, USJan 08, 15 - May 24, 22
Radnor, PA, USAug 08, 24 - Oct 31, 24

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 17
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 4
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 24

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2024/0363,5802024BONDING SYSTEMS, AND METHODS OF PROVIDING A REDUCING GAS ON A BONDING SYSTEM0
120626362024Bonding systems, and methods of providing a reducing gas on a bonding system0
2024/0266,3182024BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE, AND RELATED METHODS0
2024/0063,1692024BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE, AND RELATED METHODS0
2023/0326,9032023BONDING SYSTEMS, AND METHODS OF PROVIDING A REDUCING GAS ON A BONDING SYSTEM0

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