Shenglei WANG
Inventor
Stats
- 0 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 2 US Applications Filed
- 2 Total Citation Count
- Apr 20, 2021 Most Recent Filing
- Sep 30, 2020 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Shanghai, CN | Sep 09, 21 - Jan 24, 23 |
| Shenzhen, CN | Jan 18, 24 - Oct 29, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| F16F: | SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION | 1 |
| H03D: | DEMODULATION OR TRANSFERENCE OF MODULATION FROM ONE CARRIER TO ANOTHER | 1 |
| H04B: | TRANSMISSION | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12129901 | 2024 | Leaf spring for an integrated circuit heat sink | 0 |
| 2024/0019,009 | 2024 | LEAF SPRING FOR AN INTEGRATED CIRCUIT HEAT SINK | 0 |
| 11563407 | 2023 | Mixing circuit with high harmonic suppression ratio | 0 |
| 2021/0281,218 | 2021 | MIXING CIRCUIT WITH HIGH HARMONIC SUPPRESSION RATIO | 1 |
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