Chao-Hsin Wang
Inventor
Stats
- 2 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 5 US Applications Filed
- 56 Total Citation Count
- May 25, 2021 Most Recent Filing
- Dec 11, 2006 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
HANNSTAR DISPLAY CORP. | 1
| 2012
|
ARIMA OPTOELECTRONICS CORP. | 2
1 | 2006
2009 |
INVENTEC CORPORATION | 1
| 2011
|
Inventor Addresses
Address | Duration |
---|---|
Dashi, TW | Aug 23, 07 - Aug 24, 10 |
New Taipei City, TW | Jul 04, 13 - Jul 04, 13 |
Taipei City, TW | May 16, 13 - Dec 02, 21 |
Taoyuan County, TW | Apr 27, 10 - Apr 27, 10 |
Technology Profile
Technology | Matters | |
---|---|---|
B06B: | GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL | 1 |
B26D: | CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, e.g. BY CUTTING, PERFORATING, PUNCHING, STAMPING-OUT | 1 |
G06F: | ELECTRIC DIGITAL DATA PROCESSING | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2021/0370,541 | 2021 | ULTRASONIC VIBRATION ASSISTED MACHINING DEVICE | 0 |
2013/0169,692 | 2013 | DISPLAY DEVICE AND BRIGHTNESS CONTROL METHOD CAPABLE OF REDUCING POWER CONSUMPTION OF DISPLAY DEVICE | 3 |
2013/0124,579 | 2013 | SHOWING SYSTEM FOR PRODUCT MATERIALS AND SHOWING METHOD THEREFOR | 0 |
7781755 | 2010 | Light emitting diode by use of metal diffusion bonding technology and method of producing such light emitting diode | 3 |
7704770 | 2010 | Light emitting diode by use of metal diffusion bonding technology and method of producing light emitting diode | 2 |
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