Alan E Wang
Inventor
Stats
- 35 US patents issued
- 53 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 35 US Patents Issued
- 53 US Applications Filed
- 830 Total Citation Count
- Jul 14, 2011 Most Recent Filing
- Feb 28, 1980 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| Union Carbide Corporation | 2
| 1980
|
| BASF CORPORATION | 1
1 | 1994
1997 |
| PPG INDUSTRIES, INC. | 1
| 1997
|
| MORRISON, JOYCE L. | 1
| 1995
|
| PPG INDUSTRIES OHIO, INC. | 1
1 1 1 14 6 8 1 6 4 4 1 2 | 1995
1996 1999 2000 2002 2003 2004 2005 2006 2007 2008 2009 2011 |
| HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. | 2
1 1 | 1997
1998 1999 |
| UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION | 1
| 1992
|
Inventor Addresses
| Address | Duration |
|---|---|
| Camas, WA, US | Nov 03, 11 - Apr 02, 13 |
| Chicago, IL | Apr 19, 94 - Apr 19, 94 |
| Gibsonia, PA | Apr 10, 01 - Jan 31, 08 |
| Gibsonia, PA, US | Jul 31, 03 - Sep 04, 12 |
| Hoffman Estates, IL | Dec 03, 96 - Jan 22, 02 |
| Pittsburgh, PA, US | Jul 16, 09 - Jun 29, 10 |
| Shanghai, CH | Jun 12, 08 - Jun 12, 08 |
| Shanghai, CN | Jan 18, 07 - Aug 30, 11 |
| South Charleston, WV | Jan 12, 82 - Feb 02, 82 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B01J: | CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS | 1 |
| B05C: | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 6 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 8409982 | 2013 | Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materials | 0 |
| 8258411 | 2012 | Printed circuit board with improved via design | 2 |
| 8141245 | 2012 | Method of forming a circuit board with improved via design | 1 |
| 2011/0266,156 | 2011 | METHOD OF FORMING SOLID BLIND VIAS THROUGH THE DIELECTRIC COATING ON HIGH DENSITY INTERCONNECT (HDI) SUBSTRATE MATERIALS | 0 |
| 8008188 | 2011 | Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials | 2 |
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