AZHA Bin Wan Mat WAN
Inventor
Stats
- 0 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 2 US Applications Filed
- 2 Total Citation Count
- Aug 27, 2020 Most Recent Filing
- Dec 27, 2019 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Matsumoto, JP | Jul 20, 21 - Jan 10, 23 |
| Matsumoto-city, JP | Aug 20, 20 - Mar 18, 21 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 2 |
| H01R: | ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11552065 | 2023 | Semiconductor device | 0 |
| 11071212 | 2021 | Semiconductor device manufacturing method | 0 |
| 2021/0082,898 | 2021 | SEMICONDUCTOR DEVICE | 0 |
| 2020/0267,845 | 2020 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.