Ming-Hao Wu
Inventor
Stats
- 7 US patents issued
- 28 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 7 US Patents Issued
- 28 US Applications Filed
- 57 Total Citation Count
- Oct 17, 2024 Most Recent Filing
- Jan 14, 2013 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| UNIMICRON TECHNOLOGY CORP. | 3
3 7 3 | 2013
2015 2016 2017 |
Inventor Addresses
| Address | Duration |
|---|---|
| TAOYUAN CITY, TW | Jun 08, 17 - Jun 08, 17 |
| Taoyuan City, TW | Jun 15, 17 - Jan 30, 25 |
| Taoyuan County, TW | May 22, 14 - May 09, 17 |
| Taoyuan, TW | Oct 27, 16 - Mar 18, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B01J: | CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS | 1 |
| C09D: | COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR | 1 |
| G06F: | ELECTRIC DIGITAL DATA PROCESSING | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12256488 | 2025 | Circuit board structure | 0 |
| 12232254 | 2025 | Printed circuit board and manufacturing method thereof | 0 |
| 2025/0040,026 | 2025 | MANUFACTURING METHOD OF PACKAGE CARRIER | 0 |
| 12156325 | 2024 | Package carrier with improved heat dissipation efficiency and manufacturing method thereof | 0 |
| 12144113 | 2024 | Circuit board structure | 0 |
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