Lingyun Wei
Inventor
Stats
- 2 US patents issued
- 12 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 12 US Applications Filed
- 82 Total Citation Count
- Nov 29, 2019 Most Recent Filing
- Jun 1, 2006 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2
1 1 | 2012
2013 2015 |
ZETTACORE, INC. | 2
| 2006
|
NORTH CAROLINA STATE UNIVERSITY | 2
| 2006
|
The North Carolina State University Zettacore, Inc. | 1
| 2006
|
ATOTECH DEUTSCHLAND GMBH | 1
1 3 | 2007
2008 2009 |
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA | 2
| 2006
|
Inventor Addresses
Address | Duration |
---|---|
Englewood, CO | May 17, 07 - May 17, 07 |
Englewood, CO, US | Mar 05, 09 - Dec 04, 12 |
Mobile, AL, US | Oct 07, 21 - Aug 02, 22 |
Shrewsbury, MA, US | Aug 08, 13 - May 25, 17 |
Technology Profile
Technology | Matters | |
---|---|---|
A01N: | PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF | 1 |
B05C: | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
11401592 | 2022 | Liner alloy, steel element and method | 0 |
2021/0310,106 | 2021 | LINER ALLOY, STEEL ELEMENT AND METHOD | 0 |
2017/0145,577 | 2017 | METHOD OF ELECTROPLATING LOW INTERNAL STRESS COPPER DEPOSITS ON THIN FILM SUBSTRATES TO INHIBIT WARPING | 0 |
2017/0067,173 | 2017 | ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW INTERNAL STRESS AND GOOD DUCTILITY COPPER DEPOSITS | 0 |
2016/0312,372 | 2016 | ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW INTERNAL STRESS AND GOOD DUCTIILITY COPPER DEPOSITS | 0 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.