Yuuji Watanabe
Inventor
Stats
- 3 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 3 US Patents Issued
- 5 US Applications Filed
- 85 Total Citation Count
- Feb 21, 2014 Most Recent Filing
- Oct 8, 1985 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. | 1
| 2011
|
| SONY CORPORATION | 2
1 | 2013
2014 |
| KURODA PRECISION INDUSTRIES LTD. | 1
| 1985
|
| FUJITSU LIMITED | 1
| 1996
|
Inventor Addresses
| Address | Duration |
|---|---|
| Aizuwakamatsu, JP | Nov 20, 01 - Nov 20, 01 |
| Chiba, JP | Jun 30, 87 - Jun 30, 87 |
| Kanagawa, JP | Mar 06, 14 - Oct 20, 15 |
| Saitama, JP | Oct 06, 11 - Oct 06, 11 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23B: | TURNING; BORING | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 2 |
| H04N: | PICTORIAL COMMUNICATION, e.g. TELEVISION | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9167170 | 2015 | Imaging device and control method | 0 |
| 2014/0253,761 | 2014 | CONTROL DEVICE, CONTROL METHOD, AND IMAGING APPARATUS | 4 |
| 2014/0063,286 | 2014 | IMAGING DEVICE AND CONTROL METHOD | 7 |
| 2011/0241,068 | 2011 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | 8 |
| 6319810 | 2001 | Method for forming solder bumps | 29 |
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