Sai-Krishna Vuppala
Inventor
Stats
- 0 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 2 US Applications Filed
- 0 Total Citation Count
- Mar 7, 2023 Most Recent Filing
- Jul 26, 2019 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Wertheim, DE | Jan 30, 20 - Sep 14, 23 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| B25H: | WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS | 1 |
| B25J: | MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2023/0288,913 | 2023 | Placement method for accurately positioned placement of large components on a target region of a substrate, and associated placement apparatus | 0 |
| 2020/0030,961 | 2020 | Rework system for unsoldering and/or soldering electronic components on a circuit board | 0 |
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