Dieter Vischer
Inventor
Stats
- 4 US patents issued
- 6 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 6 US Applications Filed
- 51 Total Citation Count
- Jun 8, 2021 Most Recent Filing
- Dec 6, 1994 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| GWF- UND WASSERMESSERFABRIK AG | 1
| 1994
|
| ESEC TRADING SA | 4
| 2004
|
| GWF Gas-und Wassermesserfabrik AG | 1
| 1994
|
| UNAXIS INTERNATIONAL TRADING LTD. | 2
1 | 2005
2008 |
Inventor Addresses
| Address | Duration |
|---|---|
| Zug, CH | Oct 15, 96 - Aug 01, 23 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| B23P: | OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS | 3 |
| B26D: | CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, e.g. BY CUTTING, PERFORATING, PUNCHING, STAMPING-OUT | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11715940 | 2023 | Circular cutting unit and drive for multilayer wire | 0 |
| 2022/0393,447 | 2022 | CIRCULAR CUTTING UNIT AND DRIVE FOR MULTILAYER WIRE | 0 |
| 2008/0301,931 | 2008 | Method And Apparatus For Mounting Semiconductor Chips | 0 |
| 7415759 | 2008 | Method and apparatus for mounting semiconductor chips | 4 |
| 7159751 | 2007 | Wire bonder | 2 |
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