Sumit Varshney
Inventor
Stats
- 4 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 5 US Applications Filed
- 6 Total Citation Count
- Feb 17, 2021 Most Recent Filing
- Jul 11, 2014 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| NXP USA, INC. | 5
1 | 2014
2015 |
Inventor Addresses
| Address | Duration |
|---|---|
| Greater Noida, IN | Jun 30, 22 - Nov 01, 22 |
| Noida, IN | Sep 29, 15 - Aug 16, 16 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01G: | CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 5 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11488904 | 2022 | System and method for reducing mutual coupling for noise reduction in semiconductor device packaging | 0 |
| 2022/0208,672 | 2022 | SYSTEM AND METHOD FOR REDUCING MUTUAL COUPLING FOR NOISE REDUCTION IN SEMICONDUCTOR DEVICE PACKAGING | 0 |
| 9418873 | 2016 | Integrated circuit with on-die decoupling capacitors | 1 |
| 9337140 | 2016 | Signal bond wire shield | 1 |
| 2016/0056,099 | 2016 | INTEGRATED CIRCUIT WITH ON-DIE DECOUPLING CAPACITORS | 1 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.