der Stam Karel Maykel Richard Van
Inventor
Stats
- 4 US patents issued
- 7 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 7 US Applications Filed
- 36 Total Citation Count
- Apr 26, 2017 Most Recent Filing
- Mar 12, 2013 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
Advanced Laser SeparationInternational (ALSI) N.V. | 1
| 2013
|
ASM TECHNOLOGY SINGAPORE PTE LTD | 2
2 2 | 2013
2015 2016 |
ASM TECHNOLOGY SINGAPORE PTE LTD | 4
| 2014
|
Inventor Addresses
Address | Duration |
---|---|
Apeldoorn, NL | Sep 19, 13 - Jun 04, 19 |
Beuningen, NL | Jul 31, 14 - Oct 09, 18 |
Technology Profile
Technology | Matters | |
---|---|---|
B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 6 |
B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 1 |
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 7 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
10307867 | 2019 | Laser fiber array for singulating semiconductor wafers | 1 |
2018/0311,762 | 2018 | SUBSTRATE CUTTING CONTROL AND INSPECTION | 3 |
10096498 | 2018 | Adjustable spatial filter for laser scribing apparatus | 1 |
9786562 | 2017 | Method and device for cutting wafers | 0 |
2016/0315,010 | 2016 | METHOD AND DEVICE FOR CUTTING WAFERS | 6 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.