Aerde Steven RA Van
Inventor
Stats
- 0 US patents issued
- 11 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 11 US Applications Filed
- 426 Total Citation Count
- Mar 6, 2023 Most Recent Filing
- Dec 14, 2006 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
ASM IP HOLDING B.V. | 3
1 | 2014
2015 |
ASM INTERNATIONAL | 1
| 2007
|
SOITEC | 1
| 2007
|
ASM INTERNATIONAL N.V. | 1
1 | 2006
2010 |
Inventor Addresses
Address | Duration |
---|---|
Tielt-Winge, BE | Jun 14, 07 - Jun 29, 23 |
Technology Profile
Technology | Matters | |
---|---|---|
C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 2 |
H01J: | ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS | 2 |
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 11 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2023/0207,309 | 2023 | METHOD AND APPARATUS FOR FILLING A GAP | 1 |
2021/0313,167 | 2021 | METHOD AND APPARATUS FOR FILLING A GAP | 230 |
2018/0286,672 | 2018 | SEMICONDUCTOR DEVICE WITH AMORPHOUS SILICON FILLED GAPS AND METHODS FOR FORMING | 362 |
2018/0286,679 | 2018 | FORMING SEMICONDUCTOR DEVICE BY PROVIDING AN AMORPHOUS SILICON CORE WITH A HARD MASK LAYER | 1 |
2016/0141,176 | 2016 | PROCESS FOR FORMING SILICON-FILLED OPENINGS WITH A REDUCED OCCURRENCE OF VOIDS | 28 |
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