Ji Ho Uh
Inventor
Stats
- 2 US patents issued
- 6 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 6 US Applications Filed
- 15 Total Citation Count
- Jan 31, 2024 Most Recent Filing
- May 19, 2011 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SAMSUNG ELECTRONICS CO., LTD. | 2
2 | 2011
2013 |
Inventor Addresses
| Address | Duration |
|---|---|
| Hwaseong-si, KR | Mar 20, 25 - Mar 20, 25 |
| Seoul, KR | Aug 28, 14 - Aug 24, 21 |
| Songpa-gu, KR | Nov 24, 11 - Jul 09, 13 |
| Suwon-si, KR | Aug 22, 24 - Aug 22, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| B25J: | MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES | 1 |
| B65G: | TRANSPORT OR STORAGE DEVICES, e.g. CONVEYERS FOR LOADING OR TIPPING; SHOP CONVEYER SYSTEMS; PNEUMATIC TUBE CONVEYERS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0098,036 | 2025 | METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK | 0 |
| 2024/0279,003 | 2024 | WAFER TRANSFER APPARATUS, WAFER TRANSFER SYSTEM, AND METHOD FOR REMOVING PARTICLES IN WAFER TRANSFER APPARATUS | 0 |
| 2024/0278,437 | 2024 | SUBSTRATE PROCESSING APPARATUS | 0 |
| 11098406 | 2021 | Substrate support unit and deposition apparatus including the same | 1 |
| 2019/0203,353 | 2019 | Substrate Support Unit and Deposition Apparatus Including the Same | 2 |
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