Takaaki Tsunoda
Inventor
Stats
- 2 US patents issued
- 4 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 4 US Applications Filed
- 32 Total Citation Count
- Nov 11, 2014 Most Recent Filing
- Jan 27, 2004 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
RAKUTEN, INC. | 1
| 2014
|
INTERNATIONAL BUSINESS MACHINES CORPORATION | 2
| 2013
|
CANON ANELVA CORPORATION | 2
2 | 2008
2013 |
ANELVA CORPORATION | 1
| 2004
|
Inventor Addresses
Address | Duration |
---|---|
Albany, NY, US | Sep 18, 14 - Jun 09, 15 |
Kessel-Lo, BE | Dec 28, 10 - Dec 28, 10 |
Santa Clara, CA | Dec 09, 04 - Dec 09, 04 |
Tokyo, JP | Jun 09, 16 - Feb 26, 19 |
Technology Profile
Technology | Matters | |
---|---|---|
C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 2 |
G06Q: | DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTING PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTING PURPOSES, NOT OTHERWISE PROVIDED FOR | 1 |
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
10217143 | 2019 | Information processing system, information processing method, and information processing program | 0 |
2016/0162,958 | 2016 | INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING PROGRAM | 0 |
9053926 | 2015 | Cyclical physical vapor deposition of dielectric layers | 0 |
2014/0273,425 | 2014 | CYCLICAL PHYSICAL VAPOR DEPOSITION OF DIELECTRIC LAYERS | 1 |
7857946 | 2010 | Sputtering film forming method, electronic device manufacturing method, and sputtering system | 4 |
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