Toshihiko Tsujikawa
Inventor
Stats
- 19 US patents issued
- 22 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 19 US Patents Issued
- 22 US Applications Filed
- 166 Total Citation Count
- Oct 17, 2017 Most Recent Filing
- Jun 30, 1993 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. | 3
7 6 | 2011
2014 2015 |
GODO KAISHA IP BRIDGE 1 | 2
2 | 2008
2009 |
PANASONIC CORPORATION | 2
2 | 2006
2007 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 1
1 1 1 1 2 2 | 1993
1994 1995 1996 1999 2000 2002 |
Inventor Addresses
Address | Duration |
---|---|
Kofu, JP | Sep 03, 02 - Jan 28, 03 |
Osaka, JP | Jan 08, 09 - Oct 20, 20 |
Osaka-fu, JP | Nov 23, 99 - Dec 26, 00 |
Sakai, JP | Jun 27, 00 - Jun 27, 00 |
Toyonaka, JP | Sep 10, 96 - Mar 03, 98 |
Yamanashi, JP | May 01, 03 - Aug 21, 18 |
Technology Profile
Technology | Matters | |
---|---|---|
B23P: | OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS | 1 |
B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 3 |
B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 3 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
10813227 | 2020 | Component mounter and mounting board manufacturing method | 0 |
10058019 | 2018 | Bonding apparatus | 0 |
2018/0132,359 | 2018 | COMPONENT MOUNTER AND MOUNTING BOARD MANUFACTURING METHOD | 0 |
9872395 | 2018 | Component crimping apparatus | 0 |
9842824 | 2017 | Component mounting apparatus | 0 |
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