Kazuo Teshirogi
Inventor
Stats
- 24 US patents issued
- 30 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 24 US Patents Issued
- 30 US Applications Filed
- 613 Total Citation Count
- Jan 20, 2015 Most Recent Filing
- Jun 27, 2000 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
FUJITSU MICROELECTRONICS LIMITED | 1
| 2004
|
SOCIONEXT INC. | 1
8 2 2 6 6 4 2 2 2 | 2000
2002 2003 2004 2005 2006 2008 2009 2010 2014 |
FUJITSU LIMITED | 2
3 4 2 1 | 2000
2005 2007 2009 2015 |
Fujitsu Automation Limited | 2
| 2000
|
FUJITSU SEMICONDUCTOR LIMITED | 1
3 1 | 2002
2006 2010 |
DISCO CORPORATION | 1
| 2002
|
Inventor Addresses
Address | Duration |
---|---|
Kanagawa, JP | Apr 24, 03 - Apr 21, 05 |
Kawasaki, JP | Dec 06, 01 - May 14, 15 |
Kawasaki-shi, JP | Jun 20, 02 - Sep 25, 08 |
Yokohama, JP | Mar 03, 11 - May 21, 13 |
Technology Profile
Technology | Matters | |
---|---|---|
A47J: | KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES | 1 |
B01J: | CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS | 1 |
B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 2 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2015/0132,865 | 2015 | METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME, SUBSTRATE PROCESSING APPARATUS, AND SEMICONDUCTOR MANUFACTURING APPARATUS | 0 |
9010615 | 2015 | Bonding apparatus and bonding method | 2 |
8962470 | 2015 | Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus | 1 |
2014/0217,153 | 2014 | BONDING APPARATUS AND BONDING METHOD | 2 |
8444799 | 2013 | Method for manufacturing semiconductor device and surface protective tape | 0 |
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